Electronics and PCB Solutions
As electronics become smaller and more complex, manufacturers rely on precision laser micromachining to meet demanding tolerances. Lumentum pulsed lasers deliver clean, high-speed processing for micro vias, substrates, and conductive layers.
Overview
Lumentum’s ultrafast lasers are engineered to deliver high-precision performance in multilayer PCB and microelectronics fabrication. With sub-micron accuracy and excellent material selectivity, our systems enable advanced via drilling, layer removal, and trace patterning — supporting HDI, RF, and flexible electronics manufacturing at scale.
Applications:
• Micro via drilling in HDI PCBs with tight diameter control
• Layer ablation for selective removal of dielectrics or copper
• High-speed patterning of conductive traces on flexible substrate
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