Semiconductor
As semiconductor geometries shrink and complexity increases, laser precision becomes essential. Lumentum pulsed lasers enable micromachining of advanced materials with the accuracy and control required for next-generation semiconductor processing.
Overview
From via drilling and substrate cutting to surface texturing and dicing, Lumentum pulsed lasers support critical semiconductor manufacturing steps with repeatable, non-contact performance. Built for high-volume environments, our ultrafast systems handle brittle, composite, and layered materials with minimal stress — enabling clean features, tight tolerances, and high yields. Our technology empowers IC manufacturers, OSATs, and equipment providers to achieve greater throughput and process control at key stages of semiconductor fabrication and packaging.
Applications:
• Precision drilling and cutting of wafers, ceramics, and advanced packaging materials
• Surface modification and patterning for MEMS, sensors, and IC substrates
• Selective layer removal with minimal thermal impact
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