Dicing (Wafer/Power Device/LED/MEMS)

High-precision solutions for added-value processes on solid materials and populated wafers

Lasers have become the tools of choice in semiconductor and LED industries to singulate wafers. Lasers commonly displace conventional methods such as diamond-blade dicing systems. Lasers are being used in processes such as grooving, scribing, and full cut for substrates as diverse as silicon, low-k on silicon, sapphire, and SiC. Lasers are also becoming more effective as the thickness of a wafer lessens.