Dicing (Wafer/Power Device/LED/MEMS)

Dicing (Wafer/Power Device/LED/MEMS)

High-precision solutions for added-value processes

Lasers have become the tools of choice in semiconductor and LED industries to singulate wafers. Lasers commonly displace conventional methods such as diamond-blade dicing systems. Lasers are being used in processes such as grooving, scribing, and full cut for substrates as diverse as silicon, low-k on silicon, sapphire, and SiC. Lasers are also becoming more effective as the thickness of a wafer lessens.